Copper Clip Package for high performance MOSFETs and its optimization
Mechanical Bonding Processes
Final Product/Process Change Notification
Fabrication process & automation of power devices using Clip die bonder Abstract
![a) Cu wire bonds on an IGBT [9], (b) a DCB substrate with Al ribbons... | Download Scientific Diagram](https://www.researchgate.net/publication/289706872/figure/fig1/AS:319869900869632@1453274335320/a-Cu-wire-bonds-on-an-IGBT-9-b-a-DCB-substrate-with-Al-ribbons-10-and-c-a-Cu.png "a) Cu wire bonds on an IGBT [9], (b) a DCB substrate with Al ribbons... | Download Scientific Diagram")
a) Cu wire bonds on an IGBT [9], (b) a DCB substrate with Al ribbons... | Download Scientific Diagram
Fabrication process & automation of power devices using Clip die bonder Abstract
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Copper Clip | CIRTEK Electronics Corporation
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Figure 2 from Copper clip package for high performance MOSFETs and its optimization | Semantic Scholar
Copper Clip Packaging_Welcome to CR Micro
Thermal characterisation of a copper-clip-bonded IGBT module with double-sided cooling | Semantic Scholar
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Copper Clip Package for high performance MOSFETs and its optimization
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Assembly Instructions for the Easy-PressFIT Modules
Fabrication process & automation of power devices using Clip die bonder Abstract
Fabrication process & automation of power devices using Clip die bonder Abstract
